Laird Performance Materials Tflex™ HD90000 Thermal Gap Filler
Laird Performance Materials Tflex™ HD90000 Thermal Gap Filler features a combination of 7.5W/mK thermal conductivity with superior pressure vs. deflection characteristics. This silicone-based thermal gap filler minimizes board and component stress. The ceramic-filled silicon sheets are offered in a variety of thicknesses ranging from 0.020" to 0.200". Laird Performance Materials Tflex™ HD90000 Thermal Gap Filler is an environmentally friendly solution that meets regulatory requirements, including RoHS and REACH.
Features
- Ceramic-filled silicon sheets
- Low pressure versus deflection
- Excellent surface wetting for low contact resistance
- Minimizes board and component stress
- Low outgassing
- Large tolerance applications
- Environmentally friendly solution that meets regulatory requirements
- RoHS and REACH compliant
Applications
- Automotive
- Consumer
- Industrial
- Telecommunications
Specifications
- 7.5W/mK thermal conductivity
- 3.5g/cc density
- Low D3-D20 (<20ppm)
- 0.020" to 0.20" thickness range
- -50°C to +125°C temperature range
Related Gap Fillers
Laird Performance Materials Tflex™ HD7.5 Thermal Gap Filler
Soft silicone material that offers high deflection and 7.5W/mK thermal conductivity.
Laird Performance Materials Tflex™ RB300 Thermal Gap Filler
Exceptionally soft gap filler pads with a thermal conductivity of 1.2 W/mK.
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发布日期: 2021-04-28
| 更新日期: 2022-07-29